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Prof. Jürgen Wittmann, Dipl.-Phys.

Teaching and Research Campus Cham

Head of Teaching and Research Campus Cham

Director

1.14 (Living Lab / B-Gebäude)

09971/99673-11

consulting time

Appointments any time via email.

Sortierung:
NewspaperArticle
  • Jürgen Wittmann

Genauer hingeschaut.

In: QZ - Qualität und Zuverlässigkeit vol. 2009

  • (2009)
NewspaperArticle
  • Jürgen Wittmann

Wert der Bewertung.

In: QZ - Qualität und Zuverlässigkeit vol. 2006

  • (2006)
Lecture
  • Jürgen Wittmann

Relevance and Effects of Metal Contamination on Devices, Processes and Parameters.

In: SEMICON Europa 1995

Geneva, Switzerland

  • 03.-06.04.1995 (1995)
Journal article
  • Jürgen Wittmann
  • W. Bergholz
  • H. Hoffmann

Elymat Measurement of Intentionally Contaminated and Dry Etched Wafers.

In: Journal of The Electrochemical Society vol. 146 pg. 313-320

  • (1999)

DOI: 10.1149/1.1391606

show abstract

In the manufacturing of megabit dynamic random access memories (4 M DRAMs) the influence of dry etching processes on refresh failures is often observed. A principal reason for refresh failures are leakage currents in the isolating p‐n junction. The effects of intentional and reactive ion etching (RIE)‐induced metal contamination on the leakage currents and diffusion currents measured in the Elymat have been systematically studied. It has been shown that this technique is a convenient and process relevant monitoring tool for RIE‐ induced contamination by Fe, Mo, Cu, and Ni with a spatial resolution capability.
Patent
  • Jürgen Wittmann

Deposition of carbon into nitride layer for improved selectivity for oxide to nitride etchrate for self aligned contact etching.

  • 02.06.1999 (1999)
Patent
  • Jürgen Wittmann

Methods for protecting device components from chemical mechanical polish induced defects.

  • 02.11.1999 (1999)
Patent
  • Jürgen Wittmann

Deposition of carbon into nitride layer for improved selectivity for oxide to nitride etchrate for self aligned contact etching.

  • 18.06.1999 (1999)
Patent
  • Jürgen Wittmann

Methods for protecting device components from chemical mechanical polish induced defects.

  • 02.06.1999 (1999)
Patent
  • Jürgen Wittmann

Deposition of carbon into nitride layer for improved selectivity for oxide to nitride etchrate for self aligned contact etching.

  • 10.08.1999 (1999)
Patent
  • Jürgen Wittmann

Method for making a self aligned contact.

  • 29.12.1999 (1999)
Patent
  • Jürgen Wittmann

Method for making DRAM capacitor strap.

  • 29.08.2000 (2000)
Patent
  • Jürgen Wittmann

Dynamic random access memory.

  • 20.03.2001 (2001)
Contribution
  • Jürgen Wittmann

Next-generation Silicon Wafers.

In: Business Briefing: Global Semiconductor Manufacturing Technology 2003 (Reference Section).

Business Briefings Ltd

  • (2003)
Lecture
  • Jürgen Wittmann

Cost vs. benefit and other factors for the successful implementation of new wafer types.

In: SEMICON Europa 2003

München

  • 03.04.2003 (2003)
Journal article
  • W. Bergholz
  • Jürgen Wittmann
  • R. Winkler
  • H. Tews
  • R. Fehlhaber

Prospects for New Wafer Types and Materials in Semiconductor Technology and Factors for their Successful Introduction.

In: Solid State Phenomena (SSP) vol. 95-96 pg. 665-674

  • (2004)

DOI: 10.4028/www.scientific.net/SSP.95-96.665

show abstract

The successful introduction of a new wafer types with superior technical performance does not only depend on a favourable cost to benefit ratio, but also on strategic / business aspects such as availability at the right time for production ramp up (without overcapacities or shortages), a multiple supplier base for security of supply and strategic reasons and last, but not least early standardization, which is a hallmark of a maturing industry. Based on this, it is anticipated that most likely novel Si wafer types with functional layers will become volume products only for high end applications, whereas the standard Si wafers of 300 and 200mm will be continuously improved (not necessarily in step with the ITRS roadmap which in some aspects appears to be cost driving), with an emphasis on cost cutting and standardization. Moreover, for power, Si discrete, BiCMOS and MEMS technology, special requirements will be needed (which are a "white spot" on the ITRS roadmap). The prospects of compound semiconductors are especially favourable for novel mass market applications, such as high brightness LEDs (III-Vs) and SiC for high temperature applications.
Lecture
  • Jürgen Wittmann

Future trends of wafer types and materials in ULSI technology.

In: The 4th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium)

Kona, HI, USA

  • 22.-26.11.2004
Journal article
  • Jürgen Wittmann
  • C. Kupfer

Monte Carlo Simulation of Capacitor Shorts in Trench-Based DRAMs.

In: Journal of The Electrochemical Society vol. 152 pg. G148-G151

  • (2005)

DOI: 10.1149/1.1851036

show abstract

Polished vacancy rich material is used in high volume manufacturing of logic and memory devices. Inherent to the crystal pulling process of these materials are voids in the silicon crystal causing trench-based failure in dynamic random access memory (DRAM) chips. The number of failures per die was observed to grow with decreasing feature size. The purpose of the simulation model presented in this report is to quantify the number of these failures for future DRAM generations and thus to gain information about future material related requirements. © 2005 The Electrochemical Society. All rights reserved.
Unknown
  • Jürgen Wittmann

Session Chair des Silicon Wafers SEMI 4th Standards Workshop auf der SEMICON Europa 2005.

München

  • 13.04.2005 (2005)
Lecture
  • Jürgen Wittmann

Standardized Si wafers for commodity markets – Is there a need, are there technical challenges?.

In: SEMICON Europa 2006

München

  • 05.04.2006 (2006)
Unknown
  • Jürgen Wittmann

Session Chair des Silicon Wafers SEMI 5th Standards Workshop auf der SEMICON Europa 2006.

München

  • 05.04.2006 (2006)
Lecture
  • Jürgen Wittmann

Praxisorientiertes Prozessmanagement.

In: 4cost Kongress

Berlin

  • 08.10.2014 (2014)
Lecture
  • Jürgen Wittmann

Success Factor Proven Reliability of PV Modules.

In: Intersolar Europe 2015

München

  • 10.-12.06.2015 (2015)
Lecture
  • W. Bergholz
  • A. Reykov
  • Jürgen Wittmann

Success Factor Proven Reliability of PV Modules and Systems. Poster Contribution 5BV.2.59.

In: 2016 European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC)

München

  • 20.-24.06.2016 (2016)
Lecture
  • W. Bergholz
  • Jürgen Wittmann

How to fully Capitalize on Advanced Process Control through a Quality Management System.

In: 17th European Advanced Process Control and Manufacturing (APC|M) Conference

Dublin, Ireland

  • 10.-12.04.2017 (2017)
Book
  • Jürgen Wittmann
  • W. Bergholz

Quality Management in Technology 2018.

CreateSpace Independent Publishing Platform

  • (2018)
Book
  • Jürgen Wittmann
  • W. Bergholz

Introduction to Quality Management in the Semiconductor Industry: Students' Version. Volume I: General..

CreateSpace Independent Publishing Platform

  • (2018)
Lecture
  • Jürgen Wittmann

Zero Defects in automotive semiconductor manufacturing – dream or reality?.

In: Rudolph Yield Forum

Dresden

  • 23.10.2018 (2018)
Book
  • Jürgen Wittmann
  • W. Bergholz

Quality Management in Technology 2019.

Independent Publishing Platform

  • (2019)
Journal article
  • Jürgen Wittmann

Customer-oriented optimization of the airplane boarding process.

In: Journal of Air Transport Management vol. 76 pg. 31-39

  • (2019)

DOI: 10.1016/j.jairtraman.2019.02.002

show abstract

Commercial airlines are exposed to a highly competitive international market environment. Cost has to be reduced and efficiency has to be increased constantly. At the same time, customer satisfaction needs to be increased. Otherwise, the airline in question would face loss of market share. One area of improvement is the airplane boarding process, which has been subject to many simulation-based research projects resulting in significant reduction of boarding time. However, those models neglected the customer's wishes regarding sitting or boarding in groups. Using a simulation approach, this paper presents a model for a reduction of boarding time with consideration of customers' expectations. The achieved boarding times are found to be higher than previously reported minimum times, but show a boarding time reduction in comparison with conventional boarding strategies.